ELECTRONIC COMPONENT DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electronic component device capable of preventing the scattering of electromagnetic wave generated from an electronic component to the ambient of the device and improving the heat dissipation of the electronic component.

SOLUTION: A recess 12a capable of completely receiving the electronic component 11 into a metal substrate 12, and a window unit 12b from the bottom of the recess 12a to the lower surface, are formed. A wiring substrate 13 is connected to the lower surface of the metallic substrate and the electronic component is fixed to the bottom of the recess 12a. The input-output terminals of the electronic component are connected to the electrodes 13d of the wiring substrate exposed in a window unit 12b through bonding wires 16. A metal rid 14 is connected to the upper surface of the metallic substrate to block the opening of the recess. The electronic component is surrounded by a ground electrode formed on the metal substrate, the metal rid and the wiring substrate whereby electromagnetic wave is shielded. Further, the electronic component is connected to the metal substrate whereby the heat dissipation of the electronic component is excellent.

COPYRIGHT: (C)2004,JPO