| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate having good radiating property and a thin DC power supply device improved in radiating characteristics. SOLUTION: The thin DC power supply device 10 is equipped with the highly heat conductive substrate 1 provided with components for power conversion including a semiconductor 4, a chip inductor 5 and a chip capacitor 6 which are arranged thereon, while at least one surface of the substrate 1 or a metallic plate is provided with a highly heat conductive insulating layer formed thereon and whose thickness is not more than 200μm. In this case, the highly heat conductive insulating layer is constituted of a resin layer comprising inorganic ceramics, or a liquid crystalline polymer layer. Further, the highly heat conductive insulating layer is constituted of a highly heat conductive material whose heat conductivity is not less than 0.5W/m K. COPYRIGHT: (C)2004,JPO |
