Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
申请公布号
WO03061006(A3)
申请公布日期
2004.06.17
申请号
WO2003US00569
申请日期
2003.01.09
申请人
MICRON TECHNOLOGY, INC
发明人
TAN, HOCK CHUAN;LIM, THIAM CHYE;TAN, VICTOR CHER KHNG;NEO, CHEE PENG;TAN, MICHAEL, KIAN, SHING;CHEW, BENG CHYE;POUR, CHENG, POH