SPLIT MANUFACTURING METHOD FOR ADVANCED SEMICONDUCTOR CIRCUITS

摘要

A front-end-of-line piece (100) of a semiconductor die is manufactured in a first manufacturing line (811). A back-end-of-line piece (200) of a semiconductor die is manufactured using a second manufacturing line, (813) which will typically be different than the first manufacturing line. The front-end-of-line piece (100) and the back-end-of-line piece (200) are combined during a joining process (825) to form a semiconductor die. The semiconductor die is subsequently tested (827) to determine if the semiconductor die is a functional semiconductor die.