| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin paste composition having high reactivity, good hardenability and excellent adhesive property, in which bleeding out of a resin ingredient onto various substrates such as a metal frame, a ceramic wiring board, a glass epoxy wiring board and a polyimide wiring board, that is a problem of prior technologies, can be reduced due to enhancement of affinity between a resin and a filler by adding an organic titanium compound containing a phosphorus atom in a molecule to the resin paste composition. <P>SOLUTION: This resin paste composition comprises (A) at least one thermosetting resin, (B) at least one compound selected from a hardener or a radical initiator, (C) the organic titanium compound containing the phosphorus atom in a molecule and (D) the filler. <P>COPYRIGHT: (C)2004,JPO |
