发明名称 SUBSTRATE SUPPORT DEVICE AND SEMICONDUCTOR MANUFACTURING DEVICE EQUIPPED WITH THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a substrate support device which prevents a substrate from electrostatically being broken and can hold the substrate in a clean, high-purity state without flawing it. SOLUTION: A support part 4 which comes into contact with the substrate 1 is in a double structure comprising an internal support part 6 of an internal conductive support member for supporting the substrate and an external support part 5 of an external cylindrical member which is cylindrical covering the internal support part and prevents peeling electrostatic charge and also prevents diffusion of produced dust from the internal support part 6. The external support part 5 is joined with a support main body 2 through an expansion part 3 such as a spring. Consequently, the substrate 1 is prevented from electrostatically being charged, for example, in a heat treatment, conveyance between other process parts, and passing and reception of the substrate between the process parts, so no spark is generated. Further, the diffusion of produced dust due to contacting between the substrate 1 and support part 4 is prevented and the substrate can be stored in the external support part 5. Consequently, the electrostatic breakage and dust production of the substrate 1 can be prevented to contribute to an improvement of the yield of a product. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004172494(A) 申请公布日期 2004.06.17
申请号 JP20020338496 申请日期 2002.11.21
申请人 SHARP CORP 发明人 HARA YOSHIHITO;KIMOTO HIDENOBU
分类号 H01L21/683;H01L21/02;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/683
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