SEMICONDUCTOR SUBSTRATE SEGMENT, MANUFACTURING METHOD THEREOF, LAMINATED SEMICONDUCTOR SUBSTRATE IN WHICH THE SEGMENTS ARE LAMINATED, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor substrate segment suitable for three-dimensional lamination, a manufacturing method thereof, a laminated semiconductor substrate in which the segments are laminated, and a manufacturing method thereof. SOLUTION: A device 3, a photosensitized insulating layer 4, and a wiring 5 are provided on a device embedding side of a semiconductor substrate 2, and a first through micro conductor 6 is provided on a substrate end side. A device electrode is connected to the first through micro conductor 6 by the wiring 5. On a device non-embedding side 2b, a connection end 6a which is a tip of the first through micro conductor 6 is so formed as to protrude by a prescribed length. COPYRIGHT: (C)2004,JPO