| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which can simply and quickly remove an adhesive agent to be left on a substrate after a tape is peeled off in a method for manufacturing a semiconductor device in which a semiconductor substrate protected by the tape is ground and after that the tape is peeled off. SOLUTION: After the tape is peeled off, heat treatment is applied to the substrate 11 at a temperature higher than a decomposition temperature of the adhesive agent. The adhesive agent is decomposed and removed. It is possible to quickly remove an organic substance resulting from the adhesive agent to be left on the substrate 11 after the adhesive tape is peeled off. By this, a process to wash the substrate 11 after the tape is peeled off in water for a long time or to clean it in a organic solvent can be omitted. COPYRIGHT: (C)2004,JPO
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