METHOD FOR THE APPLICATION OF SOLDER MATERIAL, USE OF A SYSTEM FOR LASER-AIDED DIRECT METAL DEPOSITION AND CONTACT SURFACES WITH SOLDER MATERIAL

摘要

The invention relates to a method wherein a solder deposit is formed on a contact surface (12), e.g. a circuit carrier (11), such that a beam (13) of solder powder particles (14) is directed at the contact surface (12) and the solder powder particles (14) are at least melted during or shortly after the delivery thereof to the contact surface (12). Targeted movement of the beam of solder powder (13) and the laser beam (15) enable solder deposits of any particular geometry, especially those with extremely different volumes, to be produced in a single work procedure on the various surfaces of the circuit carrier (11). As a result, solder deposits having very low volumes (e.g. for flipchips) and those having very large volumes (e.g. for capacitors and resistors) can be combined with each other on said circuit carrier in an advantageous manner. The invention also relates to solder deposits which have a porous or layered structure and which can, more particularly, be produced according to the above-mentioned manner. The invention further relates to the use of a laser-aided metal deposition (LADMD) system for the above-mentioned method.