| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a non-contact IC card where inlets constituted of electronic parts such as an IC chip and packaged electronic parts are arranged between a plurality of laminated base materials wherein the deterioration of flatness due to the mounting of the electronic parts is prevented, and to provide a method for manufacturing the IC card. <P>SOLUTION: This method for manufacturing an IC card as a thermal laminating method for integrating card base materials and electronic parts by thermal fusion is provided to overlap a recessed section or opening formed at the card base materials with a position where package type electronic parts sealed by thermosetting resin or electronic parts are set, and the recessed section formed in a die is overlapped and laminated at the position, and the heating and pressurization of thermal laminating work is carried out to form a projecting section in the neighborhood of the electronic parts on the surface of the base materials. Afterwards, the projecting section is removed by grinding or polishing machine working. <P>COPYRIGHT: (C)2004,JPO |
