| 摘要 |
PROBLEM TO BE SOLVED: To perform framing for a flexible dielectric substrate (4) with small distortion during the following process of a flex circuit. SOLUTION: This method of processing a high-resolution flex circuit comprises a stage to produce a flexible dielectric substrate with outer edges, a stage to change the flexible dielectric substrate to a state virtually not in a uniform tensile status as a result of the connection made between the continuous part of the flexible dielectric substrate and a stiff frame (2) with an opening near the outer edge, a stage to change the connected flexible dielectric substrate to a state virtually in a uniform tensile status, and a stage to print a conductor on the flexible dielectric substrate while the flexible dielectric substrate connected with the frame is virtually in a uniform tensile status. The frame is polygon-shaped (such as rectangle) with rounded vertexes. COPYRIGHT: (C)2004,JPO |
