| 摘要 |
PROBLEM TO BE SOLVED: To provide wafer container cushioning materials, which can be arranged vertically in a compact manner while retaining a sufficient cushioning function. SOLUTION: When a wafer container 4 containing a plurality of semiconductor wafers is housed in an outer packaging box 5, a pair of the expanded resin cushioning materials 1, 2 are placed on the top and bottom of the wafer container 4, respectively, so that each cushioning material is arranged between the wafer container 4 and the outer packaging box 5. The cushioning material 1 has a base 21 and the cushioning material 2 has a base 41, and a cushioning projection 29 of a closed circular shape is formed on the bases 21, 41, where the cushioning projections 29 come in contact with the bottom and the ceiling of the outer packaging box 5 are protrusively formed at the interior thereof, respectively. COPYRIGHT: (C)2004,JPO |
