| 摘要 |
A present invention provides a multi-layer capacitor that can be highly downsized and increased in capacity. A present invention provides a method for manufacturing the multi-layer capacitor including a process of forming a dielectric in the same vacuum chamber, a process of treating a surface of the dielectric, a process of forming a pattern in a metal electrode, a process of forming the metal electrode, and a process of treating a surface of the metal electrode. In this method, etching the dielectric layer flattens a recessed part generated by an electric insulation part.
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