| 摘要 |
PURPOSE: A CMP(Chemical Mechanical Polishing) apparatus of semiconductor manufacturing equipment is provided to prevent the warp of a rib by inserting a reinforcing part between the rib and a frame. CONSTITUTION: A CMP apparatus of semiconductor manufacturing equipment is used for polishing a metal layer or an oxide layer of a wafer by supplying predetermined pressure. The CMP apparatus is provided with a membrane(10) divided into a plurality of regions and a plurality of ribs(12) formed at one side of each region of the membrane. The CMP apparatus further includes the first and second reinforcing parts(13a,13b) installed at the edge ribs, and a frame(11) installed between the ribs for sealing the upper portion of the resultant structure.
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