| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve adhesiveness between a substrate frame and sealed resin simply and securely by preventing a semiconductor chip from being damaged and further preventing water from getting into a semiconductor device. <P>SOLUTION: The substrate frame 14 having a plurality of recessed portions 11 is provided with the first substrate frame 12 having a plurality of through-holes bored therethrough, and the second substrate frame 13 stuck to the first substrate 12 and allowing the first substrate frame 12 and the second substrate frame 13 to be stuck to each other. The semiconductor device is provided, in which sealing resin is introduced into a plurality of the recessed portions 11 in the substrate frame 14. Further, the semiconductor device is provided, in which coating resin for electronic parts of the semiconductor chip 3 mounted on the substrate frame 14 is introduced into the plurality of the recessed portions 11 in the substrate frame 14. <P>COPYRIGHT: (C)2004,JPO</p> |
