| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for power module that can suppress warping regardless of the difference between the coefficients of thermal expansion of an insulating substrate and a heat sink and, at the same time, can prevent the falling of its coefficient of thermal conductivity, and to provide a power module. SOLUTION: The substrate 10 for power module is provided with the insulating substrate 11 and heat sink 16 provided on one surface of the substrate 11. The heat sink 16 is provided with a main body 17, a low thermally expandable material 18 having a lower coefficient of thermal expansion than the main body 17 has, and fins 19 installed to the main body 17. The main body 17 and the fins 19 are composed of an integrally molded cast material. The fins 19 are arranged in the direction connecting one end sections C and D holding flexural rigidity lower than that held between the other ends A and B between them of the facing ends A, B, C, and D of the peripheral edge of the heat sink 16. COPYRIGHT: (C)2004,JPO |
