| 摘要 |
PROBLEM TO BE SOLVED: To obtain a flexible metal laminate which is useful as a flexible printed circuit board needing high heat resistance and high pressure resistance like flip-chip bonding by improving the heat resistance of the flexible metal laminate, especially the heat resistance of a resin layer contacting a metal layer. SOLUTION: In the flexible metal laminate, at least a three-dimensional crosslinked thermosetting resin layer and a thermoplastic resin layer are laminated in turn on the metal layer. The ratio (t1/t2) of the thickness (t1) of the thermosetting resin layer to the total thickness (t2) of the total resin layers laminated on the metal layer is 7/100-85/100 so that the heat resistance of the total resin layers on the metal layer can be improved. COPYRIGHT: (C)2004,JPO |
