| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-mounting semiconductor device wherein an electrode terminal can be prevented from being tilted sharply and being mounted to a semiconductor substrate while being in contact therewith, even when a conventional manufacturing apparatus is used to provide the electrode terminal on the semiconductor substrate. SOLUTION: Supports 41 to 46 made of glass are provided on one surface of the semiconductor substrate 100. Thus, even when electrode terminals 31 and 32 to be provided are tilted, the supports 41 to 46 support them from the lower side, resulting in preventing the electrode terminals 31 and 32 from being in contact with the semiconductor substrate 100 when they are provided onto the semiconductor substrate 100. COPYRIGHT: (C)2004,JPO
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