发明名称 CAMERA ASSEMBLING METHOD AND CAMERA ATTACHED MOBILE ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To protect a ceramic board used for a camera unit from a shock and to ensure sufficiently high camera assembling accuracy without making a shape and a structure of a main body of a camera assembling apparatus complicated and without the need for a particular buffer member. SOLUTION: A camera IC 201 is mounted on a ceramic board 202, to which a flexible cable 203 is connected to configure the camera unit 2. Projections of ruled lines on a side of the flexible cable 203 are projected outwardly from each side of the ceramic board 202 and pressed into contact with a side wall 102 of a camera mount section 101, and the flexibility of the flexible cable 203 exerts a force of pressing the camera unit 2 downward in the figure to fix the position of the camera unit 2. Further, the flexible cable 203 is sandwiched between a bottom face of the camera mount section 101 and the ceramic board to act like a buffer member thereby protecting the ceramic board 202 from a shock. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004172790(A) 申请公布日期 2004.06.17
申请号 JP20020334562 申请日期 2002.11.19
申请人 TOSHIBA CORP 发明人 HARUYAMA SHUNJI
分类号 G03B17/02;H04M1/02;H04N5/225;H05K7/14;(IPC1-7):H04N5/225 主分类号 G03B17/02
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