| 发明名称 |
Solid CO2 cleaning |
| 摘要 |
A method and apparatus are provided for removing solid and/or liquid residues from electronic components such as semiconductor wafers utilizing liquid or supercritical carbon dioxide which is solidified on the surface of the wafer and then vaporized and removed from the system. In a preferred embodiment the solidification and vaporizing steps are repeated (cycled) before removal of the CO2 from the vessel. The residues are carried away with the vaporized carbon dioxide.
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| 申请公布号 |
US2004112406(A1) |
申请公布日期 |
2004.06.17 |
| 申请号 |
US20020320836 |
申请日期 |
2002.12.16 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COTTE JOHN M.;IVERS CATHERINE;MCCULLOUGH KENNETH J.;MOREAU WAYNE M.;PURTELL ROBERT J.;SIMONS JOHN P.;SYVERSON WILLIAM A.;TAFT CHARLES J. |
| 分类号 |
H01L21/304;B08B7/00;C25F1/00;H01L21/30;H01L21/302;H01L21/306;(IPC1-7):C25F1/00 |
主分类号 |
H01L21/304 |
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