| 摘要 |
A fabric having a backing layer with a lower surface, at least a portion of the backing layer adjacent the lower surface being formed from a thermoplastic material, is provided. At least the lower surface of the backing layer is heated in order to soften the lower surface of the backing layer, and a die having a surface in which are formed a plurality of recesses is forced into the softened lower surface of the backing layer in order to create a plurality of raised areas protruding from the lower surface of the backing layer. The fabric is placed on the substrate so that the raised areas protruding from the lower surface of the backing layer are in intimate pressurized contact with the substrate at an interface thereof, and a vibration or orbital welding process is performed thereon to achieve a bond therebetween.
|
