| 摘要 |
Silicone resin compositions comprising (A) a silicone resin having at least two alkenyl groups bonded to silicon atoms in a molecule, (B) an organohydrogensilane and/or organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicon atoms in a molecule, and (C) an addition reaction catalyst cure into transparent products having heat resistance and discoloration resistance and are used with LED devices for the purposes of protection, encapsulation, bonding, wavelength alteration or adjustment, and lens formation of LED devices.
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