发明名称 |
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus |
摘要 |
A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.
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申请公布号 |
US2004115920(A1) |
申请公布日期 |
2004.06.17 |
申请号 |
US20030644952 |
申请日期 |
2003.08.21 |
申请人 |
NEC CORPORATION |
发明人 |
YAMAZAKI TAKAO;INOUE HIROBUMI;HAZEYAMA ICHIRO;KITAJO SAKAE;KUBO MASAHIRO;SOGAWA YOSHIMICHI;KURODA HIDEHIKO |
分类号 |
H01L23/12;H01L21/98;H01L23/498;H01L25/10;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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