发明名称 Heat treating device
摘要 A antireflective film 50 is formed on a thermocouple 42 arranged in a processing vessel 1 of a heat treatment apparatus in order to improve the transient response characteristics of the thermocouple 42. In a typical embodiment, the thermocouple 42 is made by connecting a platinum wire 43A and a platinum-rhodium alloy wire 43B, and the antireflective film 50 is composed by stacking a silicon nitride layer 50C, silicon layer 50B and a silicon nitride layer 50A in that order.
申请公布号 US2004115585(A1) 申请公布日期 2004.06.17
申请号 US20030473248 申请日期 2003.09.29
申请人 MAKIYA TOSHIYUKI;SAITO TAKANORI;EICKMANN KARUKI;KAUSHAI SANJEEV;DIP ANTHONY;O'MEARA DAVID L. 发明人 MAKIYA TOSHIYUKI;SAITO TAKANORI;EICKMANN KARUKI;KAUSHAI SANJEEV;DIP ANTHONY;O'MEARA DAVID L.
分类号 G01K7/02;C23C16/46;G01K1/20;G01K7/04;H01L21/22;H01L21/31;(IPC1-7):F27D1/00 主分类号 G01K7/02
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