发明名称 |
Active heat sink for high power microprocessors |
摘要 |
A cooling apparatus for cooling a heat source such as a microprocessor, comprising a mobile heat sink placed in close proximity to the heat source; and a thermal conductor for conducting heat generated by the heat source to the mobile heat sink.
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申请公布号 |
US2004114327(A1) |
申请公布日期 |
2004.06.17 |
申请号 |
US20020318700 |
申请日期 |
2002.12.13 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SRI-JAYANTHA SRI M.;MOVICKER GERARD;KHANNA VIJAYESHWAR DAS |
分类号 |
H01L23/467;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/467 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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