发明名称 Active heat sink for high power microprocessors
摘要 A cooling apparatus for cooling a heat source such as a microprocessor, comprising a mobile heat sink placed in close proximity to the heat source; and a thermal conductor for conducting heat generated by the heat source to the mobile heat sink.
申请公布号 US2004114327(A1) 申请公布日期 2004.06.17
申请号 US20020318700 申请日期 2002.12.13
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 SRI-JAYANTHA SRI M.;MOVICKER GERARD;KHANNA VIJAYESHWAR DAS
分类号 H01L23/467;(IPC1-7):H05K7/20 主分类号 H01L23/467
代理机构 代理人
主权项
地址