| 摘要 |
A photosensitive assembly with a transparent layer and a method for manufacturing the same. The method includes the steps of: providing a wafer having a plurality of photosensitive chips, each photosensitive chip having a photosensitive region and a plurality of bonding pads formed at a periphery of the photosensitive region; providing a plurality of transparent layers on the photosensitive regions of the photosensitive chips, respectively; and cutting the wafer into photosensitive assemblies using a cutter. Thus, each photosensitive chip may receive optical signals passing through the transparent layer.
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