HIGH DENSITY CHIP CARRIER WITH INTEGRATED PASSIVE ELEMENTS FOR IMPROVING FUNCTION

摘要

PURPOSE: A high density chip carrier is provided to improve the function by embedding passive elements in a substrate layer. CONSTITUTION: A carrier is used for interconnecting semiconductor parts. The carrier includes the first interface, the second interface, a substrate layer, a plurality of passive elements, and a conductive part set. The first interface includes connection terminals for at least one semiconductor part. The second interface includes a connection terminal for the level of packaging. The substrate layer(200) is between the first and second interfaces. The substrate layer includes at least one via(210) for connecting the connection terminals of the first and second interfaces with each other. The passive elements(3010) are embedded in the semiconductor layer. The conductive part set related to the first interface is used for connecting the passive elements to the semiconductor part.