| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure of an electrical component and a molding substrate to mount the electrical component wherein cost can be decreased by reducing the number of parts and processes. <P>SOLUTION: The mounting structure is provided with the molding substrate 20 in which an insulating part 21 formed of an insulating resin material having insulating characteristics and a current-flowing part 22 formed of a conductive resin material having conductivity are integrally molded by two-color molding, and the electrical component 10 having an electrifying connecting part 14b capable of conductive connection against the current-flowing part 22 of the molding substrate 20. In the molding substrate 20, a part mounting part 25 capable of mounting the electrical component 10 is formed of the insulating resin material having the insulating characteristics. The electrical component 10 is mounted to the part mounting part 25 of the molding substrate 20, and simultaneously, the electrifying connection part 14b of the electrical component 10 is conductively connected to the current-flowing part 22 of the molding substrate 20. Conductive parts as separate parts are omitted, and the number of the parts and processes is reduced. <P>COPYRIGHT: (C)2004,JPO |
