| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a die attach paste for bonding a semiconductor, having characteristics excellent in curing properties and reliability. <P>SOLUTION: The die attach paste for semiconductors consists essentially of (A) an epoxy resin, (B) an epoxy resin curing agent containing a phenolaralkyl resin represented by formula (1) (n is a positive number of 1-5 as an average value) and one or more kinds of compounds selected from dicyandiamide and imidazole compounds, (C) an epoxy group-containing liquid elastomer having 500-5,000 number-average molecular weight, (D) a (meth)acryloyl group-containing polybutadiene having 500-5,000 number-average molecular weight, (E) a compound having at least one radical-polymerizable double bond in one molecule, excluding (meth)acryloyl group-containing polybutadiene having 500-5,000 number-average molecular weight, (F) a radical-polymerizable catalyst, (G) a coupling agent and (H) a filler. The die attach paste comprises 40-80 wt.% total amount of the components (A) and (B), 3-20 wt.% component (C) and 3-20 wt.% component (D) in components excluding the component (H). <P>COPYRIGHT: (C)2004,JPO</p> |
