| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck device where occurrence of particles is reduced to a minimum on a rear face of a wafer. SOLUTION: The electrostatic chuck device 10 is a unipolar type or a bipolar type and it is used for fixing the wafer 22 on it. The device is provided with a metallic electrode 11, an insulating material 13 covering the metallic electrode 11 except for a specified region, a DC voltage feeder 17 connected to the metallic electrode 11, a dielectric layer 12 which is fixed on the specified region of the metallic electrode 11 and whose upper face has a plurality of embossed parts 12a, at least one gas introduction port 23 introducing gas to a space between the wafer 22 and the dielectric layer 12, and at least one gas discharge port 25 for discharging gas from the space 24. COPYRIGHT: (C)2004,JPO |
