| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic package which can prevent the occurrence of cracks due to thermal expansion even when a substrate and a heat sink each having a thermal expansion coefficient rather different with each other are integrally formed, as the ceramic package in which a metal heat sink and ceramics are integrally formed. <P>SOLUTION: In the ceramic package 10 in which the metal heat sink 14 is bonded to the ceramic substrate 12, a plurality of recessed holes 20 are formed in the opposite side face of the heat sink 14 to the region on which the ceramic substrate 12 is bonded, thus making a thin working part 18. <P>COPYRIGHT: (C)2004,JPO</p> |
