| 摘要 |
PROBLEM TO BE SOLVED: To suppress generation of water marks in drying the processing liquid adhering to a substrate. SOLUTION: A substrate processing apparatus 1 for dry-processing a substrate is furnished with a chamber 2, a vapor feed unit 4, an opening/closing valve 6, and a control unit 7. In keeping the chamber 2 tightly close, the substrate 90 is subjected to a cleaning process using deionized water, and then high-temperature/high-pressure water vapor is fed from the vapor feed unit 4 to raise the temperature and the pressure in the chamber 2. At the time point when the surface of the substrate 90 is covered by deionized water of a temperature higher than 100°C, the control unit 7 makes the opening/closing valve 6 open to instantaneously reduce the pressure in the chamber 2 by releasing the atmosphere inside the chamber 2 to the atmospheric air. COPYRIGHT: (C)2004,JPO
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