| 摘要 |
PROBLEM TO BE SOLVED: To form easily a circuit quite excellent in conductivity by using a simplified method for reducing the wasting of materials. SOLUTION: A coating of a colloidal solution Q, with a conductive nanoscale metal powder 20 of 0.1-50 nm average grain size dispersed therein, is provided on the surface 13a of an ink resin 13 printed in a circuit pattern on a substrate 14. The colloidal solution Q and the ink resin 13 are heated for the evaporation of liquid out of the colloidal solution Q, and for the fusion of grains in the conductive nanoscale metal powder 20. This results in a conductive metal coating film 21 formed on the ink resin 13 now hardened by heating. COPYRIGHT: (C)2004,JPO
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