| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a low cost tilt switch in which manufacturing by assembly is made possible by a manufacturing method by MID (molded interconnect device) in which a circuit and an electrode etc. can be formed on a resin molding without using a conventional lead frame. SOLUTION: In an injection molding process, a plurality of pieces of through holes arranged in lattice-form on an assembled base substrate 2A and a nearly square-shape ball housing recess 6 are formed. In an electrode pattern forming process, a through hole electrode 7a, an external connection terminal 7b, an inner conduction terminal 7c, and an upper electrode pattern 7d are formed. In a conduction ball supply process, a conduction ball 5 is supplied to the ball housing recess 6 of the assembly base substrate 2A. In a jointing preparation process, a jointing member 8 is added on the jointing face of the assembly base substrate 2A. In a lid formation process, a through hole 3a is formed at the prescribed position of the assembly lid 3A. In a crimping process, the assembly base substrate 2A and the assembly lid 3A are aligned and crimped and jointed in one body. In a cutting process, the jointed assembly substrate 2A is cut by a dicing or the like along the cutting lines X, Y that pass through the center of the through holes 4 and cross orthogonally and is divided in piece-parts. Thereby, small-size, light-weight, multi-assembly production becomes possible. COPYRIGHT: (C)2004,JPO
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