| 摘要 |
PROBLEM TO BE SOLVED: To deposit a thin film with uniform film thickness and film quality on a film-shaped substrate without causing thermal damage to the film-shaped substrate, and to improve the utilizing efficiency of a target as well when performing the thin film deposition in such a manner that thin film depositing particles flown from the target is stuck to the film-shaped substrate. SOLUTION: In the thin film deposition system, thin film forming particles are flown from a target and are stuck to the surface of a film-shaped substrate running along the circumferential face of a substrate holding drum to deposit a thin film. In this case, an another target of the material same as that of the target is arranged so as to face a space between the circumferential face of the substrate holding drum and an electrode part for film deposition, a part of the thin film forming particles flown for thin film deposition from the target is stuck to the surface of the another target and recovered, and the recovered thin film forming particles are reutilized when in use of the other target. COPYRIGHT: (C)2004,JPO
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