| 摘要 |
PROBLEM TO BE SOLVED: To enable residues of a chemical processing solution and deposits attached to the surfaces of a copper foil and a base material to be removed thoroughly. SOLUTION: In a multilayer pre-bonding processing method for a printed wiring board or a copper-plated laminate, the copper surface of the printed wiring board or the copper-plated laminate is subjected to chemical processing so as to enable fine crystals of copper oxide and metal copper to be precipitated to form a film thereon, then when a surface cleaning process using water or hot water is carried out, water or hot water is circulated and filtered, the printed wiring board or the copper-plated laminate is subjected to ultrasonic cleaning by an ultrasonic cleaner from below its undersurface, the processed surface of the board is cleaned without causing damage to the shape of the film formed on its surface, and crystals as deposits on the processed surface of board can be also removed. COPYRIGHT: (C)2004,JPO
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