发明名称 SEMICONDUCTOR PACKAGES, LEAD-CONTAINING SOLDERS AND ANODES AND METHODS OF REMOVING ALPHA-EMITTERS FROM MATERIALS
摘要 The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
申请公布号 WO2004034427(A3) 申请公布日期 2004.06.17
申请号 WO2003US30783 申请日期 2003.09.25
申请人 HONEYWELL INTERNATIONAL INC. 发明人 WEISER, MARTIN, W.;DEAN, NANCY, F.;CLARK, BRETT, M.;BOSSIO, MICHAEL, J.;FLEMING, RONALD, H.;FLINT, JAMES, P.
分类号 B23K35/02;B23K35/26;C22B13/06;C25C1/18;H01L23/31;H01L23/485;H01L23/498;H05K3/34 主分类号 B23K35/02
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