发明名称 |
THERMALLY CONDUCTIVE SILICONE ELASTOMER COMPOSITION |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermally conductive silicone elastomer composition having small change of curing property with time during storage and forming a silicone elastomer having high thermal conductivity by curing. <P>SOLUTION: The thermally conductive silicone elastomer composition comprises (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organopolysiloxane having at least two hydrogen atoms bonded to silicon atom in one molecule, (C) a thermally conductive filler, (D) a phenolic compound and/or benzotriazole-based compound, (E) platinum-based catalyst and (F) an ene-yne compound and/or an alkyl alcohol. <P>COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004168920(A) |
申请公布日期 |
2004.06.17 |
申请号 |
JP20020337566 |
申请日期 |
2002.11.21 |
申请人 |
DOW CORNING TORAY SILICONE CO LTD |
发明人 |
ISHIKAWA HIRONORI;NAKAYOSHI KAZUMI;SHIMA RYOTO;MINE KATSUTOSHI |
分类号 |
C08L83/07;C08K3/08;C08K5/01;C08K5/05;C08K5/13;C08K5/3475;C08K5/375;C08K9/02;C08K9/10;C08L83/04;C08L83/05 |
主分类号 |
C08L83/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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