发明名称 LIGHT EMITTING DEVICE AND PACKAGE FOR HOUSING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To effectively preclude a light of a light emitting device from being absorbed by an insulated substrate, and also to make a package housing the device thin so that a part of the light of the light emitting device can be precluded from transmitting the insulated substrate to leak outside. <P>SOLUTION: In the package for housing the light emitting device, a recess 4 for housing a light emitting device 3 is provided on an upper surface of an insulated substrate 1, and a mounting part conductive layer 2 for mounting the light emitting device 3 and interconnection layers 5a, 5b connected to an electrode of the light emitting device 3 are formed on the bottom of the recess 4. External terminal conductive layers 8a, 8b connected electrically with the interconnection layers 5a, 5b are also formed on a lower surface of the insulated substrate 1, and the external terminal conductive layers 8a, 8b are disposed so as to overlap with a region R2 to which the insulated substrate 1 is exposed between the mounting part 2 on the bottom of the recess 4 and the interconnection layers 5a, 5b. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004172462(A) 申请公布日期 2004.06.17
申请号 JP20020338134 申请日期 2002.11.21
申请人 KYOCERA CORP 发明人 FUNAHASHI AKIHIKO
分类号 H01L33/56;H01L33/60 主分类号 H01L33/56
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