| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an multilayer wiring board free from cracking in the vicinity of a capacitor element, excellent in conductivity reliability in wiring conductor layers, and excellent in connection reliability between the capacitor element and the wiring conductor layers, for a multilayer wiring board having a built-in capacitor element. <P>SOLUTION: The multilayer wiring board comprises an insulating substrate 1 whereon a plurality of resin-containing insulating layers 1a are stacked and wherein a cavity 5 is formed with a capacitor element 3 installed therein with its surface in close contact with the inner wall of the cavity 5, and wiring conductor layers 2 formed on the surface and/or inside the insulating substrate 1. In the main body of the capacitor element 3 comprising alternately stacked electrode layers 6 and ceramic layers 7, through conductors 8 are formed and connected electrically to the electrode layers 6, and electrodes 9 are provided at the upper and lower ends of the through conductors 8 and connected electrically to the wiring conductor layers 2. A gap between the sides and the upper and lower surfaces forms an arcuate curve having a radius of curvature of 0.01-0.1 mm. <P>COPYRIGHT: (C)2004,JPO</p> |
