| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for resin-molding an electronic component wherein the environmental wrong influence given by it is so reduced as to make possible an efficient environmental conservation and its size can be reduced. SOLUTION: Firstly, there is used the apparatus for resin-molded electronic parts whereon a mold for resin-molded electronic parts which comprises a fixed mold 1 and a movable mold 2 is mounted. A board 3 mounted with an electronic part 4 is fed and set in a predetermined position of the molds 1/2. When closing the molds 1/2, the movable mold 2 is moved by the small-diameter piston of a moving mechanism B at a large stroke in a mold closing direction. Next, the moving mechanism B itself is changed into a large-diameter structure by fixing the small-diameter piston of the moving mechanism B with a fixing member C. Further, by pressing the moving/fixing mechanisms B/C of the large-diameter structure at a small stroke in the mold closing direction with a hydraulic-pressure-driven pressing mechanism D, the molds 1/2 are so closed with a predetermined mold closing pressure as to mold by a resin the electronic part 4 on the board 3. COPYRIGHT: (C)2004,JPO |
