| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg having an adhesive layer, capable of firmly bonding a conductor layer to the prepreg even in the case of using a conductor layer having a smooth surface without roughening treatment and exhibiting high heat-resistance. SOLUTION: The prepreg having an adhesive layer has a prepreg and an adhesive layer composed of a curable resin and formed on the prepreg. The curable resin contains a polyamideimide having a siloxane structure on the main chain and an amide-reactive compound. The amount X (pts. wt.) of the amide reactive compound based on 100 pts. wt. of the polyamideimide satisfies the formulas (I) and (II): 4≤(A×100+B×X)/(100+X)≤10... (I) and 1≤(C×100+D×X)/(100+X)≤15... (II) wherein A (wt.%) and C (wt.%) are amounts of the amide group and silicon in the polyamide imide, respectively, and B (wt.%) and D (wt.%) are amounts of the amide group and silicon in the amide reactive compound, respectively. COPYRIGHT: (C)2004,JPO |
