发明名称 LEAD FRAME BY ELECTROFORMING AND METHOD FOR FABRICATING THE SAME
摘要 PURPOSE: A lead frame by electroforming is provided to enable accurate patterns to be formed by adopting electroforming process, prevents waste of work and simply produce product by forming the product directly through electroforming in electroforming bath, and a method for fabricating the same is provided. CONSTITUTION: The electroforming master comprises a base(9); a root part release material(8) formed on an upper part of the base; and a pin part release material(7) and an electrode base(4) formed on an upper part of the root part release material, wherein a release material is filled in a space part of the electrode base to form the pin part release material, wherein the release material is silicone, and wherein the electrode base is stainless steel. The method for fabricating an electroforming master comprises the processes of forming an electrode base using reversal patterns by etching; filling between base and the electrode base; and forming root part release material and pin part release material. The method for fabricating an electroforming master comprises the processes of forming the separated conductor part into an electrode base by separating only a conductor part from a product fabricated; filling a release material between base and the electrode base; and forming root part release material and pin part release material.
申请公布号 KR20040050682(A) 申请公布日期 2004.06.16
申请号 KR20020079378 申请日期 2002.12.10
申请人 KIM, JUNG SIK 发明人 KIM, JUNG SIK
分类号 C25F3/12;C25D1/00;C25D1/22;H01L21/48;(IPC1-7):C25F3/12 主分类号 C25F3/12
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