METHOD FOR INSPECTING SEMICONDUCTOR CHIP OF BALL GRID ARRAY SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: A method for inspecting a semiconductor chip of a ball grid array semiconductor chip package is provided to automatically inspect the semiconductor chip by using the naked eye. CONSTITUTION: A side illumination unit installed at an upper lateral portion of a tape wiring substrate(120), to which a solder ball(139) is attached, radiates light onto the tape wiring substrate(120). An image formed by light reflected from the tape wiring substrate(120) is detected by a camera. Defect of the solder ball(139) is inspected based on the image. Light reflected from the solder ball(139) is upwardly transferred so that the camera takes the image of light. The image is doughnut-shaped. Defect and size of the solder ball(139) are detected based on a shape and the size of the doughnut image.