Laser welding components to a micro-optical bench

摘要

Many optical components now use a microelectronic substrate called an optical micro-bench as a base from which to build. Conventional devices use one or more methods of fixing the various elements together and/or onto the semiconductor micro-bench. Typically these conventional methods require special coatings to be deposited on the substrate, and the use of a separate bonding material, e.g. solder, glass or adhesive. The present invention relates to the direct fixation of a semiconductor, e.g. silicon, indium phosphide or gallium arsenide, structural component to the micro-bench made of a similar material using a laser welding technique, which uses wavelengths that are not harmful to the other elements of the component. The present invention eliminates the use of any separate bonding material, as well as several steps in the bonding process.