发明名称 |
Apparatus and method for thin die detachment |
摘要 |
The invention provides an apparatus and method for thin die detachment involving the use of a collet for holding and detaching a die mounted on an adhesive surface of an adhesive film. An ejector device comprising a plurality of ejector pins is employed to partially delaminate said die from the adhesive surface for detachment by the collet. Each ejector pin is operative to contact and raise a second surface of the film opposite the adhesive surface at a position substantially at a corner of the die to be detached within a predetermined distance from the edges of said die. <IMAGE> |
申请公布号 |
EP1429372(A1) |
申请公布日期 |
2004.06.16 |
申请号 |
EP20030078070 |
申请日期 |
2003.10.01 |
申请人 |
ASM ASSEMBLY AUTOMATION LTD. |
发明人 |
CHEUNG, YIU MING;CHONG, CHI MING;LEE, TAT WING;LEUNG, KA LOK |
分类号 |
H01L21/52;H01L21/00;H01L21/78 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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