| 摘要 |
PURPOSE: A cooling plate model using a high efficiency cooling system is provided to improve the cooling efficiency of a silicon wafer and a plate and reduce process time by using a double line for a cooling water. CONSTITUTION: A cooling plate model using a high efficiency cooling system is provided with a plate(100), the first nozzle part(105) installed at one side of the plate for flowing cooling water to the peripheral portion of the plate, and the second nozzle part(115) installed near to the first nozzle part for exhausting the cooling water. The cooling plate model further includes a double cooling line(107) for connecting the first nozzle part with the second nozzle part. A pressure controller is installed on the first nozzle part.
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