STRUCTURE OF POLISHING PAD FOR IMPROVING CMP SPEED IN SEMICONDUCTOR MANUFACTURING PROCESS

摘要

PURPOSE: The structure of a polishing pad for improving CMP(Chemical Mechanical Polishing) speed in a semiconductor manufacturing process is provided to reduce the damage of a wafer and decrease the generation of particles at the polishing pad itself by changing the upper shape of the polishing pad from a rectangle type structure to a triangle type structure. CONSTITUTION: A polishing pad(15) for improving CMP speed is made of polyurethane. The upper surface(15a) of the polishing pad is like a triangle type structure. The upper surface is used for minimizing the contact surface between the polishing pad and a wafer.