| 发明名称 |
Joining semiconductor units with bonding material |
| 摘要 |
A unit includes one or more semiconductor chips. Each chip has a front surface with a plurality of contacts surrounded by a passivated surface. The passivated surface is not wettable by bonding material. The contacts have masses of bonding material thereon and the masses have a height less than the diameter of the contacts.
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| 申请公布号 |
US6750539(B2) |
申请公布日期 |
2004.06.15 |
| 申请号 |
US20020278465 |
申请日期 |
2002.10.23 |
| 申请人 |
TESSERA, INC. |
发明人 |
HABA BELGACEM;WOLTER KLAUS-JURGEN |
| 分类号 |
H01L21/283;H01L21/288;H01L21/56;H01L21/60;H01L21/603;H01L21/68;H01L23/31;H01L23/48;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/283 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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