发明名称 Technique to quench electrical defects in aluminum oxide film
摘要 A novel technique to quench electrical defects in CVD Al2O3 layers is disclosed. A small amount of silicon dopant to the aluminum oxide film reduces the leakage current as well as the gap interface trap density at the dielectric/silicon interface. The implanted silicon gives a better interface and improves the leakage characteristics of the dielectric.
申请公布号 US6750502(B1) 申请公布日期 2004.06.15
申请号 US20000532086 申请日期 2000.03.21
申请人 MICRON TECHNOLOGY, INC. 发明人 SANDHU SUKESH;PRALL KIRK D.
分类号 H01L21/28;H01L21/316;H01L21/336;H01L29/51;(IPC1-7):H01L29/76;H01L29/788 主分类号 H01L21/28
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